high frequency pcb/rogers 5880 pcb /aron pcb board assembly 2016 china.

FOB Reference Price:Get Latest Price
US $0.01-20 / Piece | 1 Piece/Pieces rogers high frequency pcb (Min. Order)
Supply Ability:
50000 Square Meter/Square Meters per Month rogers high frequency pcb
Port:
shenzhen
Report Suspicious Activity
Overview
Quick Details
Place of Origin:
Guangdong, China (Mainland)
Brand Name:
Xing Da
Model Number:
rogers high frequency pcb
Base Material:
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic,crock
Copper Thickness:
1/2 oz min; 12 oz max
Board Thickness:
0.2mm-6.00 mm
Min. Hole Size:
0.2mm
Min. Line Width:
0.04mm
Min. Line Spacing:
0.04mm
Surface Finishing:
HASL / HASL lead free, Chemical tin, Chemical Gold,OSP
High Frequency PCB:
High Frequency PCB
Hole Positon:
+/-0.075mm(3mil) CNC Driling
Insulation Resistance:
10Kohm-20Mohm
Conductivity:
<50ohm
Test Voltage:
10-300V
Impendance Control:
+/-10%
Different Impendance:
+/-10%
Outline Tolerance:
+/-0.125mm(5mil) CNC Routing
Hole Diameter(H) PTHL:
+/-0.075mm(3mil) Non-PTH L:+/-0.05mm
Conductor Width(W):
+/-20% of original artwork PTH L:+/-0.
Packaging & Delivery
Packaging Details
rogers high frequency pcb
1.at buyer's request; 2. inner, vaccum package; 3. outer, standard export carton
Delivery Time
Shipped in 7 days after payment

 

 PCB/PCBs Assembly OEM Factory in Shenzhen

Welcome to XingDa Electric Technology Co.,Ltd

Xindaxing Electric Technology Co.,LTd 

Our Services

We can provide one-stop service:

1. PCB circuit boards+Assembly.

2. E-test.

3.Electronic components purchasing.

4. PCB assembly: available on SMT, BGA, DIP.

5. PCBA function test.

6. Enclosure assembly.

PCB product Capacity

PCB Manufacture Capacity

Item

Specification

Material

FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc.

Remarks

High Tg CCL is Available(Tg>=170)

Finish Board Thickness

0.2 mm-6.00mm(8mil-126mil)

Surface Finish

Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)

Shape

Routing,Punch,V-cut,Chamfer

Surface Treatment

Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)

Silkscreen(black, yellow, white)

Peel able-mask(red, blue, thickness>=300um)

Minimum Core

0.075mm(3mil)

Copper Thickness

1/2 oz min; 12oz max

Min Trace Width & Line Spacing

0.075mm/0.075mm(3mil/3mil)

Min Hole Diameter for CNC Drilling

0.1mm(4mil)

Min Hole Diameter for Punching

0.6mm(35mil)

Biggest panel size

610mm * 508mm

Hole Position

+/-0.075mm(3mil) CNC Drilling

Conductor Width(W)

+/-0.05mm(2mil) or +/-20% of original

Hole Diameter(H)

PTHL:+/-0.075mm(3mil)

Non PTHL:+/-0.05mm(2mil)

Outline Tolerance

+/-0.1mm(4mil) CNC Routing

Warp & Twist

0.70%

Insulation Resistance

10Kohm-20Mohm

Conductivity

<50ohm

Test Voltage

10-300V

Panel Size

110 x 100mm(min)

660 x 600mm(max)

Layer-layer misregistration

4 layers:0.15mm(6mil)max

6 layers:0.25mm(10mil)max

Min spacing between hole edge to circuitry pattern of an inner layer

0.25mm(10mil)

Min spacing between board outline to circuitry pattern of an inner layer

0.25mm(10mil)

Board thickness tolerance

4 layers:+/-0.13mm(5mil)

Flexible PCB product Capacity

FPC Tech Specification

Items

Capabilities

Layers

FPC:1 to 6 Layers, Rigid Flex: 2 to 10 Layers

Regular Base Materials

Kapton,Polyimide(PI), Polyester(PET), FR4

Base Copper Thickness

1/3 oz to 8oz

Regular Base Material Thickness

12.5um to 50um(FPC)

0.1mm to 3.2mm(Rigid)

Regular Coverlay Thickness

27um to 50um

Regular Adhesive Thickness

12um to 25um

Blind or Buried Vias

Yes

Impedance Control

Yes

Min.Line Width/Spacing

0.04mm/0.04mm

Surface Finishing

Electroplate Ni/Au(Flash gold/Soft gold/Hard gold), ENIG, HASL, Immersion Tin,OSP

Outline Fabrication

Die cut, laser cut, CNC routing, V-scoring

Hole to edge(Hard tool/Die Cut)

±0.1/±0.2mm

Edge to edge(Hard tool/Die Cut)

±0.05/±0.2mm

Circuit to edge(Hard tool/Die Cut)

±0.07/±0.2mm

 

PCB Assembly(SMT) Product Capacity

SMT Capacity

SMT Item

Capacity

PCB Max. size

510mm*460mm(SMT)

Chip component

0805 0603  0402  0201 package

Min.pin space of IC

0.1mm

Min. space of BGA

0.1mm

Max.precision of IC assembly

±0.03mm

Assembly capacity

≥8 million piots/day

DIP capacity

6 DIP production lines

Assembly testing

Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)


FCT(Functional Circuit Test)

Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.

 

Technical

1).Professional surface mounting and through hole soldering technology;

2).Various sizes, like 1206,0805,0603,0402,0201 components SMT  technology;

3).X-ray ICT(In Circuit Test), AOI(Automated Optical Inspection), FCT(Functional Circuit Test)  technology;

4).Nitrogen gas reflow soldering  technology for SMT;

5).High standard SMT&Solder Assembly line 

6).Certifications:UL, RoHS

Related Products

 High Quality PCB, FPC and PCBA!

 

 

  

View of Factory

 

Customer visiting

 

 

Exhibition Show:

 

 

 

FAQ

Q1:Are you a factory or trade company?

A: XingDa is a PCB/FPC/PCBA manufacturer/factory. We specialize at PCB/PCBs Board for 9 years. 

 

Q2:Is my PCB file safe if I send it to you for manufacturing?

A: We respect customer's design authority and will never manufacture PCB for someone else without your permission. NDA is acceptable.

  

Q3:What payment do you accept ?

A: TT/ Western Union/ Paypal/ Unistream.

 

Q4: What's your shipping way ?

A: 1. We have our own forwarder to ship goods by DHL, UPS, FEDEX, TNT,EMS. 

     2. If you have your own forwarder, we can cooperate with them.

 

Q5: How about the MOQ?

A: For PCB: 1 pcs

    For PCBA: sample order less than 10pcs, batch order at least 1000pcs

 

Q: What's your main market?

 A:Europe, USA, Brazil, Russia, Turkey, Iran, Australia, Singapore...

 

 

 

Packaging & Shipping